2014 Electronics News magazine articles at Free Technical Library

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Alphabetical list articles with annotations, from magazines published in 2014 in the journal Electronics News:

Fourth generation Bluetooth module - how to develop your first application?

CC3100 is a network processor for the Internet of things. Part I

DIN rail plus mains: power supplies for industrial automation and security systems

Kyocera Display is COMPEL's new TFT display partner

Kyocera Display: Applications of TFT displays in industry and medicine

LDO converters with low self-consumption and low voltage drop

Texas Instruments at the wheel: TI components for automotive applications

TPS62740 - the new benchmark for powering low power wireless devices

WMBUS + SPIRIT1 - the ideal solution for flowmeters / ASKUE

STMicroelectronics accelerometers: detecting any movement

Analog Integration - Springboard for Manufacturing Integration

Without foreign keys: implementation of a charger based on the MAX8934 charge controller

Fighting disorientation: practical ways to install MEMS sensors

Is your efficiency high? - DC/DC converters with single-ended output for smooth IGBT control

Feature Visualization: STM32CubeMX Graphical Code Generator

Air acupuncture: Bluetooth low energy network processor from STMicroelectronics

Doors open: DC/DC converters with a wide input voltage range

For intra-unit connections - low voltage power connectors from TE Connectivity

For a long service life: miniature signal relays IM and P2

For PORTABLE EQUIPMENT: micropower analog signal processing circuits

For accounting and identification: NFC solutions from Texas Instruments

Up to 61V input: new DC/DC converters from STMicroelectronics

Additional voltage from step-down switching regulator: inductor calculation

Launching embedded Wi-Fi using the SPWF01SA.11 module

Safety relays SR series

Protected sensors: new technologies in AMT touch screens

Tools for Tools: TI Design Software Products

Market leaders: compact power relays of the SNR, ORWH, RT series

Lithium iron phosphate: new long-life batteries from EEMB

Small but bold: Chilisin chip inductors

Multilayer solution: MULTILAYER chip varistors

Chilisin Multilayer Ferrite Chip Filters

My first application for wireless communication in the 868 MHz band - step by step instructions. Part I

For every taste: new operational amplifiers from STMicroelectronics

Setting up the LMP90xxx analog front end using the WEBENCH® app

4 mm or less - low profile surface mount power chokes

Low Voltage MOSFETs for High Current Applications and Harsh Environments

Low consumption in dynamic mode: a new line of MCUs based on Cortex-M4

New from Mean Well: managed and unmanaged power supplies for LED luminaires

New AirPrime HL GSM/3G/LTE modules: one platform for all times

New networking standards from TE Connectivity

Building on Manufacturer Experience: Maxim Integrated Reference Platforms

Features of STM32L0 operation in low voltage modes

From 5000 hours: long life aluminum electrolytic capacitors

From Standard to Powerful: New IR Transistor Drivers

Information display - novelties in the COMPEL supply line

Connecting Expansion Modules to the Main Board - Multigig RT Connectors by TE Connectivity

Connect to WiFi? There is nothing easier if you use the XBee module

Practical application of TIVA. Training course. Part I

Application of IGBT seventh generation IR in resonant circuits

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Random news from the Archive

Inexpensive dense 3D memory 10.07.2012

Applied Materials announced an important development in the field of flash memory manufacturing - the creation of a new semiconductor etching system that allows the formation of three-dimensional structures that provide higher data density per unit area and volume.

The new system, called the Applied Centura Avatar, allows the creation of flash memory chips with up to 64 vertical levels, according to the company's press service. We are talking about NAND memory - the most popular type of memory in modern mobile electronics, including smartphones and tablets. The same type of memory is used in SSDs, which are equipped with ultrabooks that are gaining popularity.

The company says the new manufacturing technology solves many of the problems that vendors who are interested in making 3D chips face. Meanwhile, multilayer chips already exist - in them, ready-made layers are superimposed on each other. In the case of Centura Avatar, we are talking about the manufacture of a three-dimensional structure from the very beginning, Applied Materials emphasized.

According to the information provided, the new technology allows significant savings to be achieved. For example, when using 3D NAND memory, the transition from 100nm to 60nm process technology can reduce manufacturing costs by almost 10 times.

The company did not say when the 3D chips that Centura Avatar allows you to create will be found in commercial devices. Partly due to the fact that the equipment for the production of such microcircuits is still very expensive.

Applied Materials is an international company with offices in the US, Canada, China, Europe, Malaysia, Singapore, Japan, Korea and Taiwan. The company employs about 12,9 thousand employees. In addition to the semiconductor industry, it specializes in display equipment, solar panels and automation software.

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