Rubber band release. Effective trick and its solution

EFFECTIVE FOCUSES AND THEIR CLUES
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Rubber band release. Focus secret

Spectacular tricks and their clues

Directory / Spectacular tricks and their clues

Focus Description:

Put a regular elastic band on the index fingers of both hands at once. Then close the tips of the thumb and forefinger of the right hand with the tips of the thumb and forefinger of the left hand. Your fingertips will remain closed, while the rubber band will fall on the table.

1. Insert two index fingers into the elastic band.

Focus Release gum

2. Bring two thumbs together so that they touch the tips of the index fingers of the same hand. Now the gum is held with two hands.

Focus Release gum

3. Turn both hands a quarter of a turn in opposite directions so that you can touch the thumb of the right hand with the index finger of the left hand and the thumb of the left hand with the tip of the index finger of the right hand. Having done this, you still keep the tips of your fingers closed.

Focus Release gum

4. To release the elastic, spread your thumbs and forefingers - it will fall on the table.

Focus Release gum

Focus secret:

The secret to the trick is turning the hands a quarter turn as you continue to hold the elastic between your fingers. Those who want to repeat your movements will neglect this convergence of the index and thumb of one hand, along with a quarter turn of the hands.

They will likely bring both thumbs and both index fingers together instead. If they bring their index fingers together with the thumbs of opposite hands, they still won't succeed as long as the rubber band is held in place.

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Samsung 4GB DDR64 RDIMMs 08.09.2014

Samsung Electronics has announced the start of mass production of 4GB DDR64 RDIMM modules that use 3D TSV package technology. The new high-performance, high-density modules will play a key role in the proliferation of enterprise servers and cloud applications, as well as further diversification of data center solutions, Samsung told CNews.

The new RDIMMs include 36 DDR4 DRAM chips, each consisting of four 4Gb DDR4 DRAM dies. The low power chips are manufactured using Samsung's state-of-the-art 20nm class process and 3D TSV package technology.

"With the introduction of energy-efficient DDR4 modules assembled using 3D TSV technology, we are taking a big step towards the mainstream DDR4 market, which should expand significantly with the expected introduction of next-generation CPUs in the second half of this year," said Jiho Baik, Vice President , Memory Solutions Marketing Division, Samsung Electronics.

Overall, the company noted that the mass production of 3D TSV modules marks a new milestone in the history of memory technology, following Samsung's first production of 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology uses tall vertical cell array structures within a monolithic die, 3D TSV is an innovative stacking technology that allows vertical layers of chips to be interconnected, the company explained.
.
"To create a 3D TSV DRAM package, DDR4 dies are ground down to a thickness of only a few tens of microns, after which hundreds of tiny holes are created in the dies. They are vertically interconnected using electrodes that are passed through the holes," said Samsung representatives. The new 64 GB TSV module has twice the performance of the 64 GB module, where the packages use wired mounting, and the power consumption of the modules is approximately halved."

In the future, Samsung says it will be possible to interconnect more than four DDR4 dies using 3D TSV technology, allowing even higher density DRAM modules to be built. This will accelerate the expansion of the premium memory market and the transition from DDR3 to DDR4 memory in the server market.

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