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A new type of thermonuclear device has been developed

08.04.2024

Fusion energy continues to be one of the most promising areas in the field of energy, striving to create clean and efficient energy sources. Recent scientific developments, such as the new MUSE stellarator presented by scientists at the Princeton Plasma Physics Laboratory (PPPL) and the US Department of Energy (DOE), are breaking new ground in this field.

Scientists at the Princeton Plasma Physics Laboratory (PPPL) and the US Department of Energy (DOE) have unveiled a new type of stellarator, a special device for nuclear fusion reactions.

Stellarators, like tokamaks, use magnetic fields to confine plasma. However, in the new device, the magnetic fields have an unusual shape, exclusive to stellarators. They are toroidal, but also twisted along the axis of the plasma “cord”. A distinctive feature of MUSE is the use of permanent magnets, which distinguishes it from other devices where the magnetic field is created by electromagnets.

The MUSE device is assembled from standard components and equipment available in the commercial sector. Permanent magnets are integrated into a 3D printed shell surrounding a vacuum chamber containing the plasma.

In addition, MUSE has high quasi-symmetry, which contributes to the effective confinement of plasma inside the device and increases the likelihood of thermonuclear fusion reactions.

Future plans include a series of experiments to study in more detail the quasi-symmetry of MUSE and its effect on plasma confinement. These studies will include more precise measurements of magnetic fields and plasma rotation speed.

The development of the new MUSE stellarator represents a significant step in the development of fusion energy. Its advanced design and use of permanent magnets could lead to more efficient and sustainable plasma confinement, which is key to achieving fusion on a practical scale.

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Samsung Electronics has announced the start of mass production of 4GB DDR64 RDIMM modules that use 3D TSV package technology. The new high-performance, high-density modules will play a key role in the proliferation of enterprise servers and cloud applications, as well as further diversification of data center solutions, Samsung told CNews.

The new RDIMMs include 36 DDR4 DRAM chips, each consisting of four 4Gb DDR4 DRAM dies. The low power chips are manufactured using Samsung's state-of-the-art 20nm class process and 3D TSV package technology.

"With the introduction of energy-efficient DDR4 modules assembled using 3D TSV technology, we are taking a big step towards the mainstream DDR4 market, which should expand significantly with the expected introduction of next-generation CPUs in the second half of this year," said Jiho Baik, Vice President , Memory Solutions Marketing Division, Samsung Electronics.

Overall, the company noted that the mass production of 3D TSV modules marks a new milestone in the history of memory technology, following Samsung's first production of 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology uses tall vertical cell array structures within a monolithic die, 3D TSV is an innovative stacking technology that allows vertical layers of chips to be interconnected, the company explained.
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"To create a 3D TSV DRAM package, DDR4 dies are ground down to a thickness of only a few tens of microns, after which hundreds of tiny holes are created in the dies. They are vertically interconnected using electrodes that are passed through the holes," said Samsung representatives. The new 64 GB TSV module has twice the performance of the 64 GB module, where the packages use wired mounting, and the power consumption of the modules is approximately halved."

In the future, Samsung says it will be possible to interconnect more than four DDR4 dies using 3D TSV technology, allowing even higher density DRAM modules to be built. This will accelerate the expansion of the premium memory market and the transition from DDR3 to DDR4 memory in the server market.

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