Scheme, pinout (wiring) cable Ericsson 8xx, 1018, T18. Scheme, description

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ENCYCLOPEDIA OF RADIO ELECTRONICS AND ELECTRICAL ENGINEERING
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Scheme, pinout (wiring) cable Ericsson 8xx, 1018, T18. Encyclopedia of radio electronics and electrical engineering

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Encyclopedia of radio electronics and electrical engineering / Mobile telephony

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The thinnest 13-megapixel module from Toshiba 04.04.2013

The Japanese company Toshiba announced the launch of a camera module equipped with a 13-megapixel 1/3' format CMOS sensor. With a thickness of only 4,7 mm, the TCM9930MD device is the thinnest among 13-megapixel modules of this class, according to the manufacturer.

The pixel diameter is 1,12 µm. Structurally, the module includes four plastic lenses and a separate signal processing circuit that allows you to improve the image. In particular, this chip compensates for distortion and improves image quality at the edges of the frame. To reduce the dimensions of the module, the so-called Flip-Chip mounting is also used, which involves attaching a semiconductor chip to the substrate with the active side down. In this case, the contacts are routed directly on the substrate of the crystal, which allows you to connect the microcircuit directly to the board, without using a case.

The novelty is aimed at use in tablet computers and smartphones. In May, trial samples will be available to customers at a price of $74,3 per copy. Mass production will start in December this year.

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