Method

1. Cut the solder to the width of your components

2. Install the component at the soldering point

3. Place the solder next to the component

4. Hold the component with your finger (Meow! I wouldn't do it. Stay hairless. Use tweezers.) and solder from one end, heating the solder with a soldering iron.
5. After soldering one end, solder the other in the usual way.

2 way: in the oven

Are you soldering SMD cards and tired of hand soldering LQFP/TQFP64 cases? Do you dream of a soldering oven, but don't have the funds? Read on for how to make a soldering oven out of a conventional one.

Read all safety documentation on your own. Further operations contain a certain risk.

Necessary equipment

Mini-oven up to 250°C (cheapest is fine)(Meow! Regular grill! Don't hesitate to use the microwave!)

Thermometer that allows you to measure the temperature in the range of 20°C - 300°C. The author used a K-type thermocouple with a multimeter.

Soldering cream (e.g. soldering cream, no cleaning, 85% Sn62Pb36Ag2 alloy, 15% RM89 flux, 25g syringe)

Ordinary syringe needles, with a diameter of at least 1 mm.

Theory.

Soldering takes place in several stages
1. Heating.The temperature of the component and solder gradually increase.
2. Drying.The time required for the flux to act and completely evaporate. Equals 1 min 30 sec.
3. Melting.Melting the soldering cream and heating up to the maximum temperature, which is the melting point of the cream + 20°C.
4. Cooling.

This characteristic varies depending on the soldering cream. See the documentation for your cream.

Temperature characteristic of the furnace.
Describe your oven.
1. Heat oven to 125°C. The slope of the curve should be 1-4°C/min.
2. Stop heating within 1 minute 30 seconds.
3. Switch on the oven again and heat up to 210°C.
4. Turn off the oven and open the door.

The characteristic will be, for example:

Notes

The heating rate is slightly less than recommended by the manufacturer - nothing particularly terrible.

The drying phase is not very stable. If the temperature drops significantly, you can turn on the oven a little so that the temperature does not fall below 120°C.

The swim is excellent.

Cooling, stage 1 is good, but cooling slows down from 80°C. In this case, the card can be taken out of the oven at 80-70°C. Do not pull out early, because. components may move.

Some sites use MK-based temperature control with a memory characteristic of the cream. Taking into account the thermal inertia of the stove, this method does not seem very useful, and besides, it works like that ...

First test

Apply slightlycream on the card on the basis that the cream loses about a third of its volume. If there is too much cream, it can spread between the legs - you will have to clean it.

Install the component and place the board in the center of the oven. The thermocouple should be as close to the board as possible.

Set the oven temperature to 250°C and turn on both top and bottom resistors.(Meow! Apparently, both heaters of the stove are meant - upper and lower.)

At 125°C, turn off the oven for one and a half minutes.

Turn on to raise the temperature to 210°C.

First you will see how the cream melts, then it transforms into tin droplets that will fix the legs of the component on the tracks.

At 210°C the process is finished, you can turn off the oven and open the door.

In summary:

You just have to check if the component is still alive ;)

What you need to know