ENCYCLOPEDIA OF RADIO ELECTRONICS AND ELECTRICAL ENGINEERING
electrical insulating materials. Adhesives. Encyclopedia of radio electronics and electrical engineering Encyclopedia of radio electronics and electrical engineering / Electrical materials Phenol polyvinyl acetate adhesives designed for bonding metals and non-metals. Adhesives brands BF-2 and BF-4 used for bonding non-ferrous metals, stainless steel, thermosetting plastics, organic glass, wood, porcelain, ceramics, fiber, leather, paper and other materials in any combination. Glue BF-4 used in cases where the adhesive connection must be elastic and resistant to vibration. Adhesives of the BF-2N and BF-4N brands recommended for gluing ferrous metals, grade BFR-2 - for gluing packages of magnetic circuits, grade BF-6 - for gluing fabrics, felt, felt, cellophane, etc. Adhesive for polystyrene consists of benzene (96% by weight) and polystyrene (4%) in the form of chips. It is used for gluing parts made of polystyrene. An adhesive containing 10% polystyrene is used to secure the winding ends of high frequency coils to polystyrene frames. Glue for PTFE (in mass parts): MBK-1 compound, rosin - 3, castor oil - 4. The temperature of the glue during gluing should be 100-120 ° C. acrylic adhesive (2-3% organic glass and 97-98% dichloroethane) is used for bonding organic glass. Adhesive rubber (in mass parts): natural rubber - 1, dissolved in 10-15 parts of solvent gasoline or aviation gasoline. Glue 88-N is a solution of rubber compound N31 and butylphenol formaldehyde resin in a mixture of ethyl acetate and gasoline in a ratio of 2:1. Designed for cold bonding of rubber and metals. Glue 88-N can be used to glue rubber to glass, wood, leather and other materials, as well as glue rubber to rubber. The glue is applied in a thin layer on the surfaces to be glued, which are joined after the glue has dried (until tacky). The adhesive joint is kept under slight pressure for several hours. Glue with sediment must be thoroughly mixed before use. Epoxy adhesives are used for bonding metals and as compounds (aggregates), if an appropriate filler is added to them. Such glue without filler is used for gluing glass, porcelain, ceramics, as well as for gluing them to metals. To reduce the rigidity of the adhesive, a plasticizer is used. Epoxy adhesive with a hardener introduced into it hardens at room temperature. Composition of some epoxy adhesives is given in table. 1.10 (in mass parts). Table 1.10. The composition of the epoxy adhesive (in mass parts) * Note. Other resins (ED-5, ED-37) may be used. For making glue it is desirable to heat the epoxy resin to a temperature of 60 ° C and add a plasticizer to it. If necessary, a filler is added to the resin, which several times crowns the bonding strength. The resulting composition is mixed, after which a hardener is introduced into it and mixed again. The prepared adhesive must be used immediately, as it cannot be used after hardening. As a filler, you can also use talc, aluminum or bronze powder, ground glass or porcelain, graphite or ebonite dust, etc. Glue PFE-2-10 used for bonding aluminum and duralumin, silicate and organic glass, wood, leather, paper, rubber, leather and rubber, polyamide films and fabrics. Glue K-300-61 used for gluing steel, alloys of titanium, magnesium, aluminum, asbestos textolite, asbestos cement, fluoroplast-4 among themselves and in various combinations. The surfaces of the parts to be bonded must be well cleaned and degreased. The adhesive joint is maintained at room temperature under a pressure of 10-100 kPa. Author: Koryakin-Chernyak S.L. See other articles Section Electrical materials. Read and write useful comments on this article. Latest news of science and technology, new electronics: Air trap for insects
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