Printing-parallel installation. Scheme, description

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ENCYCLOPEDIA OF RADIO ELECTRONICS AND ELECTRICAL ENGINEERING
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Printing-parallel installation. Encyclopedia of radio electronics and electrical engineering

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Encyclopedia of radio electronics and electrical engineering / Ham Radio Technologies

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Perhaps, not a single radio amateur can do without printed wiring now, the advantages of which - a high density of parts, the reliability of the assembled circuits - are obvious. However, significant difficulties arise in the manufacture of printed circuit boards. Take at least the most common etching method we have. It is not always possible to accurately varnish the board with a mounting pattern, and the etching process itself is rather complicated. In addition, in the manufacture of transistor receivers, high and low frequency amplifiers, measuring instruments, or components of computing and cybernetic devices, the same boards are often needed. The method of printed-parallel assembly, which we will describe, not only does not require special devices and special skills, but also allows you to make any number of boards of the same type using a simple conductor.

Printed-parallel boards are made of foil-coated getinaks and differ from the usual ones in that the connecting conductors on them are arranged in parallel. Circuit elements are installed on the connecting conductors. If necessary, the conductors can be cut into separate parts or interconnected by jumpers.

To get a high density of mounting, you need to carefully consider the placement of circuit elements on the board.

To do this, as usual, a wiring diagram is drawn up on graph paper, best of all on a scale of 2: 1.

Let's analyze how the board is prepared for mounting a low-frequency amplifier to a transistor receiver (Fig. 1).

Print-and-Parallel Editing
Rice. 1. ULF scheme: C1, C2 - EM or Tesla: C3 - IT-1; R1 - variable resistor with switch; R2 - ULM or MLT - 0,25; loudspeaker - 0,2 GD-1 with a voice coil resistance of 28 ohms.

First, a rectangular plate of predetermined dimensions is cut out from a piece of foil-coated getinax or textolite. Then, with a caliper, the foil is divided into seven equal strips, between which the foil is cut (Fig. 2).

Print-and-Parallel Editing
Rice. 2. Board preparation

After that, holes are marked and drilled from the side of the foil layer. The drill should have a diameter of 1,0-1,2 mm. Where necessary, incisions are made with a sharp scalpel (Fig. 3).

Print-and-Parallel Editing
Rice. 3. Finished board

Print-and-Parallel Editing
Rice. 4. Location of ULF parts on the board

Circuit details and connecting jumpers (single-core tinned wire with a diameter of 0,5-1,0 mm) between individual strips are installed on the reverse side of the board (Fig. 4).

You need to solder the circuit with a small soldering iron, and its tip should not be wider than the foil strip. When soldering, make sure that the solder does not spread and does not close adjacent areas.

Printed-parallel boards can be made without foil getinaks. To do this, with BF-2 glue, strips of thin copper foil are glued onto any insulating material (textolite, getinaks. Plexiglas, etc.) with a thickness of 1,5-2,0 mm and the plates are heated at a temperature of 100-120 ° for two hours .

Authors: S.Belotserkovets, A.Ovsyannikov, Moscow

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