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Hyperstable artificial protein

26.02.2020

A new hyperstable artificial protein has been created at Shinshu University in collaboration with Princeton University. Its predecessor, the WA20 protein, could withstand temperatures of up to 75°C. It is expected that protein nanostructural blocks using SUWA will be applied to nanotechnology and synthetic biology research in the near future.

Proteins and self-organizing protein complexes perform functions inside a living organism, like nanomachines, which makes them a key component in various reactions. An artificial protein with desirable functions could have many applications in biopharmaceutics and provide chemical reactions with low environmental impact. This nanotechnology is on the scale of molecules - 1/1000000 of a millimeter, which makes them difficult to work with, but has many promising applications.

Proteins denature or break down, irreversibly changing their structure, such as when the water around an egg boils or a piece of fillet turns into a steak. This prevents proteins from being used when they should be able to withstand heat. Scientists had high hopes for the use of proteins in nanotechnology and synthetic biology. A new development - SUWA (Super WA20) - a protein in the form of a "pillar" was able to withstand a temperature of 100 ° C and not be destroyed at the same time.

The protein SUWA de novo (Super WA20) is significantly more stable than its predecessor WA20. SUWA did not boil at 100°C, but WA20 denatured at 75°C. It was found that the average denaturation temperature of the SUWA protein is 122°C. It is an ultra-stabilized artificial protein.

The characteristic three-dimensional structure of the SUWA U-topology dimer was elucidated by X-ray crystallography. Molecular dynamics modeling suggests that stabilization of the center of the alpha helices contributes to the structural stabilization and high thermal stability of SUWA.

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A team of researchers from IBM and Dow Corning Electronics announces a discovery that will allow silicon to displace copper in creating fast, energy-efficient photonic connections on printed circuit boards. The team demonstrated optical waveguides using a photonic polymer at Photonics West 2013 in early February.

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The presentation at Photonics West "Stable and Machinable Optical Silicone for Low Loss Polymer Waveguides" was presented by Brandon Swatowski, Project Engineer at Dow Corning Electronics Solutions.

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