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Latex Printing Technology on Rigid Media

26.03.2018

HP Inc. announced the release of HP Latex R Series, the first HP Latex printing technology to print on flexible and rigid materials using HP Latex Inks, which deliver the most accurate color and white quality. HP Latex R Series uses a single six-color ink set, delivers unparalleled quality at high print speeds, and is the first true hybrid latex technology that brings HP's unrivaled flexible printing capabilities to rigid media.

HP Latex R Series Technology delivers high quality prints on many tough media such as foam, styrofoam, cardboard, corrugated polypropylene, hard plastics, aluminum, wood, glass and more. Unlike UV printing technology, which creates a thick layer of ink that completely covers the media and takes time to dry, HP Water-based Latex Inks maintain the look and texture of the media. They are also distinguished by the absence of smell, safety for the environment and the printer operator.

"HP Latex R Series technology sets new industry standards and enables print service providers to create stunning prints on rigid and flexible media," said Santi Morera, Head of Graphic Solutions Business, HP Inc. "Our customers can expand their range of offers with highly profitable products and services, as well as to implement creative ideas and concepts for signage and shop windows that can attract new customers."

HP White Latex Ink uses an innovative white ink recycling mechanism to prevent white ink residue and a unique storage system that automatically mixes unused white ink to minimize wastage. White Latex Ink guarantees a glossy, high quality, pure white color that will not yellow over time (unlike traditional white UV inks).

"White inks have always been a problem for the industry. Traditionally, they use larger, heavier pigment particles that often clog printheads, or the opaque mixture separates and settles to the bottom of the ink tank. Until recently, the only solution was to physically shake the tanks, - said Tom Brown, Chief Inkologist, HP Inc. "Significant chemistry and engineering improvements make the new HP White Latex Ink and HP Latex R Series technology an industry breakthrough."

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Innovative production of 3D nanochips 27.07.2013

New microscopy technology will facilitate the development and control of the production of XNUMXD semiconductor chips.

Scientists from the National Institute of Standards and Technology (NIST) have upgraded the optical microscopy technology they developed several years ago and adapted it to observe nano-sized objects, which allows them to control the production of elements of three-dimensional semiconductor chips of a new generation. With the help of this technology, called TSOM (Through-Focus Scanning Optical Micr), one can not only examine the nanoscale components of chips, which until recently were two-dimensional structures, but also determine differences in their shapes and sizes with a sufficiently high accuracy, which is required for carrying out technological control.

New generations of semiconductor chips are composed of three-dimensional elements that are superimposed on each other. For the correct and reliable operation of the chip as a whole, it is required that all components have the correct shape and strictly specified dimensions. Existing methods of microscopy - electron, atomic force and others - can provide control of the shape and size of chip elements, but they do it extremely slowly, with the risk of damaging the fragile structure of the chip, and they are also extremely expensive. And the use of optical microscopy methods is limited by the fact that the dimensions of the chip elements are much smaller than half the wavelength of visible light (250 nm for green light), so an optical microscope cannot physically see such small objects.

TSOM technology allows you to see optically objects that are approximately 10 nm in size, and even smaller in the future. The TSOM method uses a conventional optical microscope that takes not one, but many defocused XNUMXD images of an object of interest from multiple viewpoints. Using the brightness changes from these out-of-focus shots, the computer calculates light gradients and defines the boundaries of the objects being shot, thus creating the resulting three-dimensional image.

The images obtained using the TSOM method are somewhat abstract, but the details that are visible on them make it possible to determine differences in the shapes and sizes of semiconductor chip components with a fairly high accuracy.

"Our research has shown that with TSOM, we can view elements as small as 10 nm, which is enough to control semiconductor manufacturing processes for the next decade," says Ravikiran Attota, a scientist at NIST. TSOM technology can be used not only in the electronics industry, but also in other industries, in science and everywhere where it is necessary to analyze and control the shapes of tiny three-dimensional objects."

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