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Amazon Airship Warehouses

01.01.2017

Amazon has filed a patent application for Airborne Fulfillment Centers (AFC).

Filled with enough of the most in-demand items, such airships will fly to locations where Amazon predicts increased demand is expected, according to the patent. In turn, drones, including temperature-controlled food delivery models, will be on the AFC and sent down for fast, accurate and safe delivery.

As an example of the application of such a system, the patent cites a sporting event. For example, if there's a major championship going on down there, the Amazon airship can be loaded with snacks and themed souvenirs. In addition, the AFC could descend closer to the audience to provide audio support or display advertisements on a huge display.

In addition to Amazon's central airships, the patent also describes smaller shuttles that can transport personnel, drones, and supplies to central AFCs. They are also equipped with drones and can in turn deliver goods directly to consumers. Of course, all elements of this extensive network must be connected to inventory management systems and regulated centrally.

The patent states that airships and drones can act as network cells, transmitting weather, wind speed, direction of travel to each other, or sending e-books to readers on the ground, for example. So far, all this is more like a concept, but who knows - maybe soon the airspace of our cities will be occupied by airships and drones scurrying everywhere. The only problem is that there may not be room for flying cars.

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Random news from the Archive

Self-healing chips 28.09.2006

A group of American scientists began a three-year project to research the technology of creating microchips that can independently recover from failures, reports Extreme Tech.

The start of work on the project was announced last week at a conference on design automation, held in San Francisco, representatives of the corporation Semiconductor Research, US National Science Foundation and Michigan State University.

It is supposed to build a chip design technology that will more efficiently search for faulty parts of the chip, transfer computing functions from non-working parts to working ones, and then correct the problems that have arisen and return the repaired section to operation. In this case, the microchip will be able to recover through the use of online software and its own components.

Currently, semiconductor redundancy is used to find and diagnose problems in semiconductors, which requires significant additional costs, performance degradation and an increase in chip size. Reliability modeling of complex systems is becoming increasingly complex as it requires consideration of more and more diverse factors, from defects in silicon wires to flaws in software applications.

The study will develop both a direct and intuitive error correction model, and create fast and accurate ways to analyze infrastructure reliability.

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