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SOI process technology for RF chips for mass applications

05.12.2015

Toshiba Electronics Europe announced the development of a new generation TarfSOI (Toshiba advanced RF SOI) workflow optimized for the production of radio frequency (RF) switches. RF switch ICs made using the new TaRF8 process technology, such as the new SP12T devices, provide the industry's lowest insertion loss class. SP12T RF switch IC trial samples based on the new manufacturing process will begin shipping in January 2016.

The SP12T RF switch ICs designed for smartphones have an integrated MIPI-RFFE controller for mobile solutions. The switches can be used in 3GPP GSM, UMTS, W-CDMA, LTE, and LTE-Advanced devices.

Products manufactured using the new TaRF8 SOI-CMOS TarfSOI wafer process provide the industry's lowest insertion loss class of 0,32 dB at 2,7 GHz. Compared to products based on Toshiba's current TaRF6 process technology, insertion loss is improved by 0,1 dB while maintaining the same level of distortion.

Today's mobile communications require the transmission of large amounts of data at high speeds, and therefore the RF switch ICs used in mobile devices and smartphones must support multi-port operation and have improved RF performance. Reducing insertion loss is considered particularly important in this regard, as it reduces the loss of radio signal transmission power, thereby increasing the battery life of mobile devices.

Toshiba develops high-performance RF switch ICs in-house using SOI-CMOS technology, which integrates analog and discrete circuits. By pursuing all aspects of the manufacturing process, from RF component process development to RF switch IC design and manufacturing, Toshiba is able to rapidly develop SOI-CMOS technology based on the results of its own RF switch IC development. Working as an integrated device manufacturer (IDM) allows the company to quickly create new manufacturing process technologies suitable for mass production and bring products to market using state-of-the-art manufacturing processes.

The company will continue to improve the efficiency of its own TarfSOI process and meet market and customer needs for RF switch ICs by introducing products based on the latest technologies ahead of other manufacturers.

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