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Thermal masking for electronics

11.04.2012

A group of French scientists have proposed a new approach to creating invisibility in the infrared range. Thermal cloaking works on the same principles as optical cloaking, and in the future will allow the development of new methods of heat removal in electronics, opening up new possibilities in the design of spacecraft and military equipment.

The latest advances in optical invisibility are based on metamaterials that bend light and make objects invisible. Scientists from Aix-Marseille University and the CRNS National Center have proven that the same approach can be applied to thermal camouflage. Although the new technology uses the basic theories applied to optical invisibility, it has one key difference. So far, cloaking research has only focused on wave trajectory manipulation. These include electromagnetic (light), sound, seismic and hydrodynamic waves. In turn, French scientists use thermal diffusion for thermal masking (transfer of components of gas mixtures or solutions under the influence of a temperature gradient).

Heat is not a wave, and it cannot travel long distances. In a two-dimensional model, the scientists directed heat flows from the hot zone of the object to the cool zone through the region between isotherms (concentric diffusion rings). The researchers then changed the geometry of the isotherms and forced the heat flow to bypass the circular area to the right of the heat source. Thus, it is possible to protect the object from heating or vice versa to concentrate a large amount of heat in a small volume. The ability to protect a specific area from heat is very attractive to electronics manufacturers. With the new technology, it is possible to prevent overheating of nanoelectronic and microelectronic devices, which are very difficult to cool with conventional methods.

Currently, French scientists are working on the creation of prototypes of thermal masking for microelectronics, the first samples will be ready within the next few months.

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Samsung Galaxy Note 3 11.09.2013

Samsung Electronics introduced the new flagship smartphone Samsung Galaxy Note 3 at IFA 2013 in Berlin. The device is equipped with an enlarged Full HD Super AMOLED display with a diagonal of 5,7 inches and is powered by an octa-core Samsung Exynos 8 processor (four cores at 5420 GHz and four cores at 1.9 GHz). The amount of RAM has increased to a record 1.3 GB, and the battery capacity - up to 3 mAh. At the same time, the smartphone has become thinner (3200 mm) and lighter (8,3 g.) of its predecessor.

Built-in memory is 32 GB, but the device can work with microSD up to 64 GB. The 13 MP camera on the Samsung Galaxy Note 3 has a smart gimbal and CRI LED flash.

In the software installed on the new flagship Samsung, a significant emphasis was placed on data security. The Samsung KNOX platform allows you to run applications inside a "container" that protects data from malware and phishing at the system level. Users will be able to store corporate applications and service information using Samsung KNOX, and the IT service will work with the storage through the Exchange ActiveSync Server (EAS).

The Samsung Galaxy Note 3 also comes with Find My Smartphone, which will lock your device if it's lost or stolen. If necessary, information from the device can be deleted remotely.

The design of the device has also undergone changes. The back panel, which was made of plastic in previous models, is now made with a textured leather-like finish. Samsung Galaxy Note 3 will be available in two colors: black and white.

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