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Intel Xeon Scalable Server Processors

08.04.2021

Intel has announced its most advanced processors to date, the 3rd generation Xeon Scalable, also known as the Ice Lake-SP family. These 10nm CPUs on the current Sunny Cove architecture belong to the Whitley server platform (LGA4189).

Initially, Ice Lake-SP server chips were supposed to be released a couple of years ago, but due to problems with the development of the 10nm process technology, Intel postponed their release several times. The main areas of application of these new "stones" are hybrid clouds, high performance computing (High Performance Computing), network technologies and computing related to artificial intelligence and machine learning.

Intel Announces 3rd Gen Xeon Scalable (Ice Lake-SP) Server Processors - 10nm, Up to 40 Sunny Cove Cores, Up to 6TB RAM per Socket, and 64 PCI Express 4.0 Interface Lanes

3rd Gen Intel Xeon Scalable CPUs have up to 40 Hyper-Threaded cores, up to 60MB L1,5 cache (4MB per core), eight-channel DDR3200-6 memory controller (up to 64TB RAM per socket), and up to 4.0 PCI Express 270 interface lines. The regular heat pack of new products reaches 11,2 watts. To combine individual "stones", the system uses the Ultra Path Interconnect (UPI) bus: three lines at speeds up to XNUMX GT / s (gigatransactions per second).

Intel Announces 3rd Gen Xeon Scalable (Ice Lake-SP) Server Processors - 10nm, Up to 40 Sunny Cove Cores, Up to 6TB RAM per Socket, and 64 PCI Express 4.0 Interface Lanes

The 3rd generation Intel Xeon Scalable family is divided into several series for specific tasks: models with H and HL suffixes are designed to work in systems with four and eight sockets (4S-8S), and regular SKUs without letter suffixes are for servers with one and two sockets (1S-2S). Standing apart is the Y-series for 1S-2S systems, which stands out for its support for SST-PP 2.0 technology (a mechanism that allows you to use several performance optimization profiles for each system). The family also includes models optimized for media and virtual machines, as well as for servers with liquid cooling.

Among the key advantages of the 3rd generation Xeon Scalable, the manufacturer notes support for AVX-512 instructions, Deep Learning Boost and Optane DC Persistent Memory. These chips are compatible with Optane PMem 200, Intel Optane Solid State Drive P5800X and Intel SSD D5-P5316 SSDs, Intel Ethernet 800 Series Network Modules, and Intel Agilex FPGAs.

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The stylus automatically slides out of the smartphone body 15.06.2015

The United States Patent and Trademark Office (USPTO) has published Samsung's patent application for "Electronic Device Having Automatically Ejectable Input Pen".

We are talking about a digital pen like the S Pen, which is used in devices such as the Galaxy Note 4 and Galaxy Note Edge phablets. As planned by Samsung, to remove the stylus from the body of the gadget, the user will need to say a certain voice command and (or) draw a predefined pattern on the touch screen with his finger.

To automatically eject the pen, it is proposed to use a special system of small electromagnets with different polarities: this will allow the stylus to be pushed out of the device body. And to hold the pen inside the gadget, a locking mechanism can be used, clinging to the groove in the tip area.

As conceived by Samsung, the presence of a system for automatically ejecting the pen in certain situations will increase the convenience of working with phablets and tablet computers.

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